All images: Sub 20 Micron Traces with < 3% variability
- Fine Line/Pitch PCB Substrate thru ENIG
Controlled Conductor Build-Ups with 15µm spacing
Improved Geometries for High Speed RF/Mv Applications
- Commercial 4-Layer Interposer for UFBGA (ultra-fine pitch ball grid array)
Prime aerospace/defense customer requiring advanced technology and high reliability.
HIGH PERFORMANCE MATERIALS
Additive Circuits Technologies has combined its proprietary solutions with leading edge materials including Advanced Connectivity Solutions from Rogers Corporation (e.g. RO3000®, RO4000®, RT/duroid®, and TMM® laminates), high performance glass reinforced epoxy resin systems, Alumina, and additional novel composites and laminates.