All images: Sub 20 Micron Traces with < 3% variability

  • Fine Line/Pitch PCB Substrate thru ENIG
  • Controlled Conductor Build-Ups with 15µm spacing

  • PTH Cross-section

Improved Geometries for High Speed RF/Mv Applications

  • Commercial 4-Layer Interposer for UFBGA (ultra-fine pitch ball grid array)
  • Prime aerospace/defense customer requiring advanced technology and high reliability.

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Additive Circuits Technologies has combined its proprietary solutions with leading edge materials including Advanced Connectivity Solutions from Rogers Corporation (e.g. RO3000®, RO4000®, RT/duroid®, and TMM® laminates), high performance glass reinforced epoxy resin systems, Alumina, and additional novel composites and laminates.